Xecs Call 4

Building Electromagnetic Compatibility (EMC) compliance cases for large configurable systems presents an increasingly complex challenge. Many EMC standards require manufacturers to conduct risk analyses to derive performance criteria and test levels. Even after a decade of experience with these risk-based EMC standards, manufacturers, laboratories, certifiers, and regulators continue to face difficulties in implementation. La RAMBLA for EMC aims to develop an automated, process- and data-driven EMC risk management framework from which AI/ML EMC recipe builders are instantiated. This initiative will significantly reduce EMC measurement time, enhance compliance, and results in safer systems. The project will focus on model-based systems engineering, a goal structured risk management process, automation of better representative EMC tests addressing the following areas: • Risk management process for safety-critical System-of-Systems, • Systems engineering models with EMC views, taxonomy and ontology, • EMC relational and time-series data models, • EMC recipe builder instances from the La RAMBLA platform using domain - and use-profiles. • EMC simulation and test automation, • AI/ML EMC analysis, • Report generation. La RAMBLA fosters collaboration across safety-critical product domains and value chains, capturing innovative knowledge for EMI-resilient system design and use within its laboratory risk-aware model-based learning automation platform.

This project will continue the development of a sustainable advanced flexible electronics platform leveraging cutting-edge Electronics manufacturing technology for high-performance, scalable solutions as a follow-up of the previous HyperStripes project. This new project utilizes roll-to-roll manufacturing to achieve efficient mass production on flexible substrates, ensuring cost-effectiveness and speed. This project will create a multilayered, high-resolution, circuitry on flexible products on both sides of the foil, interconnected with reliable VIAs. These are preferably a combination of (long-distance) power lines and miniaturised active layers on both sides of the foils. Techniques to create such circuits are electronics printing, foil transfer method and metal plating, combined with high-resolution metal deposition techniques, such as lithography, and impulse printing. This also includes high-speed reliable interconnection techniques for component mounting and soldering; and surface functionalisation for active sensor creation like graphene. Finally, the project aims to create a (roll-to-roll) inter-operational) pilot line for high-volume component placement including pick and place of SMT, ASICS and flexible electronic components. By using the open technology platform, the emerging technologies developed by the partners will reach a broad spectrum of possible applications beyond the targeted use cases of medical diagnostic devices, lighting goods and IoT devices. MultiStripes outcomes will create significant economic leverage for the targeted industries, as represented by the key industrial partners.

The MariSens project objective is to automate and enhance the inspection and predictive maintenance of maritime infrastructure. MariSens develops a multi-faceted framework that enables the full cycle of autonomous inspection processes with main innovations: (1) cooperative mission control for airborne, on-surface and underwater autonomous vehicles; (2) autonomous Launch & Recovery system for UUV on USV; (3) novel sensors for underwater assets inspection; (4) multi-modal AI-based analysis algorithms for detection of underwater infrastructure defects, UxO, and suspicious events; (5) offshore 5G mesh system for inspection operations; (6) adaptive UxV autonomous/manual take-over control system and (7) sensor-on-buoys permanent wide-area monitoring of marine traffic, noise and pollution. The business impact of novel sensors and automation of marine infrastructure inspections is evident: reduction of inspection cycle, lower costs, less manual work, non-intrusive sensing, higher accuracy in defect analysis. Coherently, the framework will enable wide area real-time monitoring for anthropogenic noise, pollution and emissions.

SensorTech4Health (ST4H) 2030 addresses major pain-points in current consumer health products by using innovative sensing solutions. By developing application-specific electronic components and intelligent systems, significant innovations become possible—primarily benefiting those in need, while also contributing to societal improvements targeting cost-effective healthcare solutions. These include, (1) enhanced hearing experiences via smaller, safer and smarter hearing devices like hearing implants, hearing aids and earphones, (2) wearable and bedside devices allowing continuous monitoring of health and well-being status to provide actionable insights, and (3) smart home devices facilitating long-term independent lifestyles. ST4H brings industrial players in manufacturing hearing implants (COCH), and sensor & AI technology (Bosch group), together with device makers for consumer health in wearable devices (PO), smart textiles (STX) & smart clothing (HSK), truly innovative start-ups in the field of modern semiconductor process technology (VSP) & digitalization (INT), accompanied by highly renowned, scientific experts in measurement technology (USAAR), clinical neurophysiology (UFR) and mental health (NIMH). The consortium is strategically configured to strengthen the European and global market by leveraging the industrialisation of project outcomes to generate significant economic benefits in 2031: 110-150 M€ additional revenue for digital sensor solutions and 240M€ for hearing implants.