MultiStripes

Abstract

This project will continue the development of a sustainable advanced flexible electronics platform leveraging cutting-edge Electronics manufacturing technology for high-performance, scalable solutions as a follow-up of the previous HyperStripes project. This new project utilizes roll-to-roll manufacturing to achieve efficient mass production on flexible substrates, ensuring cost-effectiveness and speed. This project will create a multilayered, high-resolution, circuitry on flexible products on both sides of the foil, interconnected with reliable VIAs. These are preferably a combination of (long-distance) power lines and miniaturised active layers on both sides of the foils. Techniques to create such circuits are electronics printing, foil transfer method and metal plating, combined with high-resolution metal deposition techniques, such as lithography, and impulse printing. This also includes high-speed reliable interconnection techniques for component mounting and soldering; and surface functionalisation for active sensor creation like graphene. Finally, the project aims to create a (roll-to-roll) inter-operational) pilot line for high-volume component placement including pick and place of SMT, ASICS and flexible electronic components. By using the open technology platform, the emerging technologies developed by the partners will reach a broad spectrum of possible applications beyond the targeted use cases of medical diagnostic devices, lighting goods and IoT devices. MultiStripes outcomes will create significant economic leverage for the targeted industries, as represented by the key industrial partners.