Xecs Call 3

Development of Hybrid-Bonding and Robust Packaging Technologies for High-Performance Micro and Power Electronic Components and Systems to be used in the Demanding and Harsh Environments of Automotive, Industrial, and 'New Energy' Applications. Besides Design and Process Innovations, HyPACT also pushes the equipment development for the actual manufacturing as well as for quality assurance. This is necessary for a fast transfer of the project results into industrial production practice.

The PAPAI project is focused on advancing Industry 4.0 in the assembly and packaging of electronic components and systems. Digitalization and data science-based manufacturing processes along the process chain are key to staying competitive in the production of ECS. The two manufacturing sites, Infineon and Saykal, are involved in the project to demonstrate the results. For example, Infineon is a global player and clear leader in automotive semiconductors, and power discretes and modules, and has manufacturing for assembly and packaging located in Regensburg and Saykal is a producer of automotive component. By introducing novel AI-assisted material development, digital twin requirements, AI-assisted inline monitoring, comprehensive power train analysis, and AI-based testbeds for traction inverter with high efficiency, the project aims to empower Industry 4.0 and enable smarter manufacturing with faster innovation and shorter feedback cycles. Through research in digitalization and AI-based tools tailored to semiconductor manufacturing complexity, the project seeks to improve process efficiency and manufacturing, resulting in shorter development and production times for new products. With PAPAI the EU packaging and assembly value chain partners including material, equipment, process, production and reliability capabilities will be strengthened. Interaction and data exchange to use the data along in a system context is only feasible by linking the different expertises together – data gathering with the equipment, AI technology development based on millions of data points & the semiconductor manufacturers, having the knowhow about the qualified and tested end products. The consortium includes semiconductor and system suppliers (Infineon, Saykal), one material suppliers (Roartis) equipment suppliers (budatec, Delvotec, PVA Tepla), AI-technology suppliers (BigTRI, Matworks) from Belgium, Germany, and Turkey. Research institutes and universities (Sirris, TU Freiberg) enable deep dives into research topics of simulations and AI methods, while the collaboration of partners along the value chain is a key project strength. Belgium, Germany, and Turkey.

At "INGENIOUS" project, we aim to develop a novel and universal photonics integrated circuit platform based on a heterogeneous integration of thin-film lithium niobate (TFLN) technology with InP SOA amplifiers and detectors using a wafer-scale technique called micro-transfer printing (uTP). Moreover, we also aim to develop a fully industrial supply chain for this technology from composed of SMEs and industrial partners covering the full product development flow from EDA tools and design houses to foundries, packaging houses and end-users.

We aim at an innovative Industial Robot based Automobile Driving Simulator (IRoADSim) to evaluate and forecast intoxicated driver behaviour. IRoADSim includes a system for in-cabin monitoring of drunk driver behaviour (camera, biological sensors), advanced control methods, and a cyber-physical simulator. We will create a comprehensive virtual model of drunk driver behaviours based on synthetic data and real data collected from volunteers.The results of the comprehensive IRoADSim will be evaluated with vehicles, improving the accuracy of the model, thus making the IRoADSim a valid tool for predicting the behaviour of drunk drivers. Ultimately, IRoADSim will support reducing drunk-driving incidents and fatalities.

The prevalence of chronic diseases , also known as non-communicable diseases , is putting a structural load on our healthcare system. Our current healthcare system relies mainly on pharmaceutical solutions which are expensive and have a low efficacy. This project will build a platform for peripheral-nerve based Bioelectronic Medicine (BEM) which will revolutionize how we practice medicine and dramatically improve the outcomes of healthcare. The goal is to build a microelectronic chip and a small, flexible formfactor of an implantable pulse generator as the core of a universal neuro-stimulator. This chip and formfactor will act as a platform, and will be specified and validated based on three application areas: neuro-based cancer treatment, severe migraines and spinal cord stimulation.

SonoSkin is a project aimed at developing an affordable and scalable wearable ultrasound technology for continuous monitoring of critical body functions both in hospital and home settings. The project involves the development of open-access platform technologies using MEMS ultrasound technology in combination with edge AI to manufacture wearable devices (patches) that can monitor processes deep inside the body. SonoSkin will allow for the realization of a multitude of wearable ultrasound applications from multiple manufacturers and demonstrate these in challenging 2D ultrasound products and 3D ultrasound concepts. The project will focus on developing two challenging use cases, lung monitoring and musculoskeletal health monitoring, using fused ultrasound and EMG sensor systems that offer decision support for clinicians to set ventilator settings, and a wearable ultrasound garment that tracks skeletal movements. Additionally, the project will develop a reference design for wearable 3D ultrasound products, which will assist the user in the optimal placement of the wearable ultrasound device and extract relevant clinical information.