Abstract
Development of Hybrid-Bonding and Robust Packaging Technologies for High-Performance Micro and Power Electronic Components and Systems to be used in the Demanding and Harsh Environments of Automotive, Industrial, and 'New Energy' Applications. Besides Design and Process Innovations, HyPACT also pushes the equipment development for the actual manufacturing as well as for quality assurance. This is necessary for a fast transfer of the project results into industrial production practice.
Germany 
Austria