Abstract
Supercomputing systems face tremendous challenges concerning the packaging technologies for the communication and signal processing units, for the heat removal and the power delivery. This is in particular the case for automotive supercomputer platforms for autonomous driving at level 5, when the high information interchange rates on the multiple physical channels need to lead to real-time driving decisions in most trustable and reliable way. e²LEAD focusses on the field of advanced packaging to enable the development of supercomputing platforms "Made in Europe" for the automotive industry while working on three research domains: Connectivity for high-performance data and thermal interfacing, Technology for automotive chiplet and smart power system (SPS) packaging and integration, and Reliability/Safety for new test strategies and digital twin-based design methods.
Germany 
The Netherlands 
